Desiccants
Automating Your Technology™
ARIDPAK™ “ROUND CLAY” DESICCANTS
Keaco’s ARIDPAK™ “ROUND CLAY” desiccants are used to absorb moisture inside our ARIDPAK™ moisture barrier bags after vacuum sealing. These non dusting desiccants can also be used in a wide variety of industries such as medical, pharmaceutical, food as well as many other applications.
Why choose ARIDPAK™ “ROUND CLAY” desiccants?
- Activated “round clay” desiccants create a packet that is smoother and less likely to puncture moisture barrier bags when compared with standard granular clay
- Round clay desiccants absorb more moisture than granular clay
- ARIDPAK™ desiccants will absorb 50% more moisture than required by MIL-D3464E, whereas silica gel will only absorb 3.5% more than required
- Packaged in non dusting Tyvek® packets
- Available in 1 and 2 unit sizes
- Desiccants are packaged in a bag that is re-sealable with a twist tie and placed into a sealed tin container
- Humidity indicator card included to verify desiccant activation
- ARIDPAK™ desiccants can be regenerated
- Activated clay desiccant meet MIL-D-3464E and MIL-P-116E
- Inexpensive
- In stock and available for immediate shipment
Tyvek® is a registered trademark of du Pont de Nemours and Company
ARIDPAK™ Round Clay Desiccant
ARIDPAK™ is a low-cost, efficient desiccant using a high grade of activated “round clay” — a naturally occurring montmorillonite clay rather than a chemically synthesized absorbent, making it more economical than silica gel or molecular sieve and safe to dispose of. ARIDPAK™ unit bags exceed MIL-D3464E performance requirements: at 20% relative humidity, ARIDPAK™ absorbs 50% more moisture than the spec requires (vs. 3.5% for silica gel).
Round desiccants also outperform granular clay desiccants — no sharp edges to puncture moisture barrier bags, and 3–26% better absorption across humidity ranges.
Typical Applications
Electronic component packaging, machine parts, military instruments, pharmaceuticals, motors, circuit boards, relays, oceanographic devices, document storage, film/photographic equipment, foodstuffs, batteries, optical devices, and more.
| Test Condition | 25% RH | 50% RH | 90% RH |
|---|---|---|---|
| After 24 hrs | 9.5 | 16.8 | 37.3 |
| After 48 hrs | 12.6 | 21.3 | 44.7 |
| After 72 hrs | 14.7 | 22.5 | 48.0 |
| After 96 hrs | 15.5 | 22.9 | 49.8 |
| After 168 hrs | 16.7 | 23.2 | 52.2 |
Packaged in various sizes of non-dusting packets (“units”), made of desiccant-grade nonwoven Tyvek® spunbond olefin fiber.
- Exceeds MIL-D-3464E performance requirements
- ISO 9001:2015 Certified — Perry Johnson Registrars, Cert. #C2024-04152, valid through Sept. 18, 2027
Regeneration (MIL-D-3464)
- Arrange bags in a single layer on a wire tray for airflow. Use a convection/forced-air oven at room temperature to start.
- Allow 1.5–2.0 inches of clearance above the bags; if using radiant/infrared heat, shield bags with 16 inches minimum clearance. Do not let temperature rise faster than 0.25–0.50°F per minute.
- Set oven to 245°F. Warning: Tyvek melts at 250–260°F. (Non-MIL-D-3464E reactivation of silica gel/Bentonite clay can be done at 220°F.)
- Hold at temperature for 24 hours, then move immediately to a desiccator jar or 0% RH airtight container to cool.
- Once cooled, store in a sealed poly liner or moisture-proof container.
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